Polyimide Film

 Polyimide Film is produced by the polycondensation reaction between an aromatic dianhydride and an aromatic diamine.

In addition, Polyimide Film developed especially for the FPC industry, gives circuit designers the flexibility to match the polyimide film's coefficient of thermal expansion (CTE) exactly to the CTE of copper to prevent circuit curling during temperature cycling. Polyimide Film is ideal for high temperature applications that require a low-shrinkage film.

Polyimide Film has a unique combination of electrical, thermal, chemical and mechanical properties and retains these properties