thin film

Tools of the S-MAT series are used in leading Chip fabs and toolmakers since 1996 when the first tools were introduced. They have become an important method for quickly and easily measuring thin film properties on 150mm through 300mm wafers at various key processing steps. The systems are available in several configurations to meet every film measurement requirement. Thickness, density surface and interface roughness. Low K films may be measured for thickness, porosity and pore size distribution. Recently, the was introduced to complement the S-MAT Series.