THICK FILM

Thick Film metalization is used to construct electrical circuits onto ceramic or metal substrates for automotive electronics, microelectronics packaging, resistive heaters, and passive circuit applications. In the process, a series of metal traces and up to 35 dielectric layers are created on the substrate using sintering and drying processes.

Thick Film metalization is used to construct electrical circuits onto ceramic or metal substrates

  • Country:Singapore
  • telephone:65-1 978 667 4111
Thick Film metalization is used to construct electrical circuits onto ceramic or metal substrates
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Diameter 28mm 0.7mm thickness coated pipe.

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