Crm is a supplier in the field raw material of sputtering thin film. We offer many kinds products a longer time. Our customers are satisfied with our products. And now, our company is generalizing our products. Hope we can be your new partner and cooperation very well.Sputtering targets sputtering materials for the applications to magnetic disk and head, magneto optical disk, optical disk, superconducting thin film, protective film.Metal Sputtering Targets (include Rare Earth metal Sputtering Target):Al, Sb, Bi, B, Cd, C, Ce, Cr, Co, Cu, Dy, Er, Eu, Gd, Ge, Au, C, Hf, Ho, In, Ir, Fe, La, Lu, Mg, Mn, Mo, Nd, Ni, Nb, Pd, Pt, Pr, Re, Ru, Sm, Se, Sc, Ag, Si, Ta, Tb, Tm, Sn, Ti, W, V, Yb, Y, Zr, Zn, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, YAlloy Sputtering Targets: AlCu, AlCr, AlMg, AlSi, AlSiCu, AlAg, AlV, CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr, CoCrMo, CoFe, CoFeB, CoNi, CoNiCr, CoPt, CoNbZr, CoTaZr, CoZr, CrV, CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr, DyFe, DyFeCo, FeB, FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi, NiTi, NiV, SmCo, AgCu, AgSn, TaAl, TbDyFe, TbFe, TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr, WRe, WTi, WCu, ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY, ZnAl, ZnMgCeramic Sputtering Targets:Boride Sputtering Targets Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2, LaB6, Mo2B, Mo2B5, NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2Carbide Sputtering Targets: B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrCFluoride Sputtering Targets: AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6, SrF2, ThF4, YF3, YbF3Nitrides Sputtering Targets: AlN, BN, GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrNOxide Sputtering targets: Al2O3, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO: Al, ZrO2(unstabilized), ZrO2-5-15wt%CaO)Selenides Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSeSilicides Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2Sulfides Sputtering Targets: Sb2S3, As2S3, CdS, FeS, PbS, MoS2, NbS1.75, TaS2, WS2, ZnS,Tellurides Sputtering Targets: CdTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTeOther: Cr-SiO, GaAs, Ga-P, In-Sb, InAs, InP, InSn,Purity:99%,99.9%,99.95% 99.99%,99.995% 99.999% and 99.9999%.Shape: Foil, sheet, rod, pipe, tube, ring, wafer, plate, tablet and base on your drawing. Disk, rectangle, band, rod and other shapesDimension: Diameter (<_650mm></_650mm>1mm), Custom-Made
Crm is a supplier in the field raw material of sputtering thin film. We offer many kinds products a
SPUTTERING TARGET BONDING Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded ...
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Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded to a metallic or ceramic ...