Ag plated foils are broadly used in electronic devices those require high conductivity and electromagnetic properties.JeonYoung ECP produces Ag plating foils with different plating thickness and
various substrates according to the conductivity and operating environment of electronic devices. Substrate foils used for Ag plating Substrate Plating specification Properties Usage Nodule Rz:
5~10?m Corrosion resisting Phosphor bronze General Plating Rz: 0.3~7?m Glossiness Electronic devices STS Width: 10~300mm Lubrication Electrodes used for electric contacts Steel Length: 100~3000m
Abrasionproof PCB Properties of silverElementSpecific Specificgravity(g/ ) Meltingpoint(