4.The adhesive tape is used for IC packing.
3. The substrates of Flexible Printed Circuits Board (F-PCB).
2. The backing material of pressure-sensitive adhesive tape, F46 (FEP) tape.
1. Electric magnetic wire and cable coiling, motor slot liners, transformer interlayer insulation.
Application
Mordohar PIF Polyimide film is a kind of heat resistant film possessing excellent physical, chemical, and electrical properties, which performs successfully in the wide range of temperature as low as -452F(-269c) and as high as +436F(+260c) and can be exposed at +752F(400c) in short time. Besides, it is of atomic radiation resistant. Polyimide film is currently the macromolecular compound with the best combined properties and the highest heat resistant.
Polyimide Film PIF type