Synthetic resin-bonded paper pads with thickness from 0.5 mm to 3.0 mm subsidiary material for drilling of printed-circuit boards according to Branch Standard /BS/ 04 78187-85; Synthetic
resin-bonded paper pads on phenol base; Synthetic resin-bonded paper pads with covering sheets on melamine base.
Synthetic resin-bonded paper pads with thickness from 0.5 mm to 3.0 mm