Mobile phone motherboard
Product Details
12) High precision pcb placement technology capacity
11) Up to 22 layers mixed assembly technology Capacity
10) Nitrogen gas reflow soldering technique for SMT
9) With IPC610D manufacturing and other international standards
8) Full in house design and Rapid Prototyping for customer
7) OEM & ODM, DFM & DFT, EMS
6) UL,CE,FCC,RoHS standard
5) AOI,X-Ray,ICT(In circuit test),FCT (functional circuit test)
4) IC precision: 0.3mm
3) BGA,CSP,QFP
2) 0402,0201 placement
1) SMT and Through-hole/DIP
PCB Assembly for Mobile phone motherboard
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- Model Number:MP901
- Country:China (Mainland)
- telephone:86-769-85309148
| Model Number: | MP901 |
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