Print Circuit Board(PCB) for mobile phone

4mil / 20mil

4mil / 20mil

Peelable thickness

0.2mil --1.2mil

0.2mil --1.2mil

Solder mask thickness

Au 0.8 - 4U"
Ni 100-300U"

Au 0.8 - 4U"
Ni 100-300U"

Immersion gold

Au 0.8 - 80U"
Ni 50-500U"

Au 0.8 - 80U"
Ni 50-500U"

Gold flash

6 oz / 5 oz

5 oz / 4 oz

base copper thickness(outer/inner)

+(-)5%

+(-)10%

Impedence

2.5mil/2.5mil
2.5mil/2.5mil

3.0mil/3.0mil
3.0mil/2.6mil

Line width/space(inner)

Line width/space(outer)

12:1

10:1

aspect ratio

0.1mm

0.15mm

Hole size

0.2mm--6.0mm

0.3mm--5.0mm

Thickness(max)

30

28

layer (max.)

20"x40"

20x40"

Panel size(inch)

technical capacity for sample production

technical capacity for batch production

Our technical capacity for your reference:

The print circuit board is designed with innovation,whole RoHS PCB manufacturing process

The print circuit board is designed with innovation,whole RoHS PCB manufacturing process

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