Bluetooth Module Class 1
Product Details
2006.2.20
PCB
1.0
1.6
10.0 x 10.0
32
SIG Qualification
material
Lead Pitch (mm)
Body THKs (mm)
Body Size (mm)
Pin Count
Mobile Phone, AP, PDA, USB Dongle ect.
Applications
with X-tal
HCI Firmware Only
Software Supply Model
-88dBm
Sensitivity
17dBm
Tx Power
Class 1
Power Class
3.0 ~ 3.3V
Operating Voltage Range
-20 ~ +70deg C
Operating Temperature
UART, USB, PCM, 12C, SPI
Interface
Mask ROM, 16kb EEPROM
Program Memory Size
CSR BC04 - ROM
Chip Set
Ver. 2.0 + EDR
Bluetooth Spec
Specification
The HBH1X1M is the Bluetooth Class 1 product. It loaded the RF chip, X-Tal, Filter, PA, LNA, Passive element at PCB circuit and receiving sensitivity -88dBm, transmission Power 17dBm, it is a product which Including EDR to Data Rate 3Mbps.
We have Semiconductor Package Technology. so, we got Maximization of Environmental reliability ( temperature, pressure, dust, etc )
Description
1. Semiconductor Package Technology. it's highly reliability
2. Size : 10 x 10
3. Sensitivity : -88dBm
4. Tx Power : 17dBm
- Tx Power: 17dBm
- Model Number:HBH1X1M
- Brand Name:Philcomkorea
- Place of Origin:Gyeonggi-do South Korea
- Country:South Korea
- telephone:82-19-2782421
| Delivery Time: | 6 ~ 8 weeks |
| Package: | Box packing ( tray in Box packing. ) |
| Supply Ability: | 50000 Piece/Pieces per Month |
| Minimum Order Quantity: | 100 Piece/Pieces |
| Payment Terms: | T/T |
| Port: | Incheon airport |
| Tx Power: | 17dBm |
| Model Number: | HBH1X1M |
| Brand Name: | Philcomkorea |
| Place of Origin: | Gyeonggi-do South Korea |
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