Bluetooth Module Class 1
Product Details
PCB
1.0
1.6
13 x 13
36
SIG Qualification
Material
Lead Pitch (mm)
Body THKs (mm)
Body Size (mm)
Pin Count
Cellular Handsets ,Personal Digital Assistants(PDA) ,Data Transfer Application ,Digital Cameras ,USB Dongle , Access Points
Applications
with X-tal
-85dBm
Sensitivity
16dBm
Tx Power
Class 1
Power Class
3.0 ~ 3.3V
Operating Voltage Range
-20 ~ 45'c
Operating Temperature
UART, USB, PCM, 12C, SPI
Interface
8Mb Flash
Program Memory Size
CSR BlueCore 4 - External
Chip Set
Ver. 2.0 + EDR
Bluetooth Spec
Specification
LNA, PA, Passive element at PCB circuit and receiving sensitivity -85dBm, ransmission Power 16dBm, support Data Rate 3Mbps , it is a product of the Bluetooth 2.0+ EDR(Enhanced Data Rate).
The HBG1X3N is the Bluetooth Class 1 product. It loaded the RF chip, X-Tal, Filter,
Description
1. SIP system
2. Size : 13.0mm x 13.0mm
3. Tx Power : 16dBm
4. Sensitivity : -85dBm
- Tx Power:16dBm
- Model Number:HBG1X3N
- Brand Name:Philcomkorea
- Place of Origin:Gyeonggi-do South Korea
- Country:South Korea
- telephone:82-19-2782421
| Delivery Time: | 6 ~ 8 Weeks |
| Package: | Box packing (tray in Box packing.) |
| Supply Ability: | 50000 Piece/Pieces per Month |
| Minimum Order Quantity: | 100 Piece/Pieces |
| Payment Terms: | T/T |
| Port: | Incheon airport |
| Tx Power: | 16dBm |
| Model Number: | HBG1X3N |
| Brand Name: | Philcomkorea |
| Place of Origin: | Gyeonggi-do South Korea |
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