Carrots Dices

The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ...

Come From Henan E-Grind Abrasives Co., Ltd

Disco Diamond Blade Our Disco dicing blade with Hub is with a stronger edge, which makes the diamond blade disco more rigid and keeps the edge not to be broken, so the cutting with the disco saw blades is in high efficiency and of excellent quality. This wheel is mainly used ...

Come From Henan E-Grind Abrasives Co., Ltd

Henan E-Grind Abrasives Co., Ltd can offer the semiconductor industry cutting-edge dicing blades & grinding wheels of the utmost quality. Diamond tools play a significant part in the production of semiconductors from a wafer to a single chip. Dicing Blade & Grinding Wheels For ...

Come From Henan E-Grind Abrasives Co., Ltd