Dicing Frame

To make semiconductor, there are process of cutting water to hundreds of IC chips in milimeter. This process is call "Dicing Process". To settle the wafer, "Dicing Frame" is used.

To make semiconductor, there are process of cutting water to hundreds of IC chips in milimeter.

  • Type:Other Educational Toys
  • Country:Malaysia
  • telephone:60-603 3290 1122
Type: Other Educational Toys
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Ready Made Window Frames: Quality and Convenience Combined

Ourready made window framesoffer the perfect combination of quality and convenience. Easy to install and made from top-grade materials, they are an ideal choice for any homeowner. Check out Manvik Door and Frame for more options. ...

Come From Manvik Door and Window Frame

Dicing Blades Without Hub

The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ...

Come From Henan E-Grind Abrasives Co., Ltd

Dicing Blades With Hub

Disco Diamond Blade Our Disco dicing blade with Hub is with a stronger edge, which makes the diamond blade disco more rigid and keeps the edge not to be broken, so the cutting with the disco saw blades is in high efficiency and of excellent quality. This wheel is mainly used ...

Come From Henan E-Grind Abrasives Co., Ltd