SiGlaz Intelligent Defect Analysis (IDA) software

SiGlaz Software also provides engineering resources to customize the software for specific customer applications.

IDA is a Spatial Signature Analysis software, and it may be integrated into the fabrication process to identify concentrated defect signatures (e.g., scratches or micro-scratches) or to identify distributed defect signatures, such a those resulting from the failure of a process tool. The software integrates into the fabs data base management and SPC system; it is compatible with advanced Microsoft .NET framework and XML format.

SiGlaz Intelligent Defect Analysis (IDA) software provides semiconductor fabs with an automatic excursion monitoring capability that integrates seamlessly into existing yield management architecture to provide immediate value-added functionality. IDA monitors inspection results files (KLARF) in production and automatically recognizes spatial defect signatures resulting from equipment failure and process excursions.

INTELLIGENT DEFECT ANALYSIS OVERVIEW