CPU Heatsink Compounds-04
Product Details
Thermal Conductivity:>1.829W/m-K
Thermal Impedance:>0.123oC-in2/W
Supreme Performance Heat sink Compounds
Thermal Conductivity:>0.965W/m-K
Thermal Impedance:>0.215oC-in2/W
Supreme Performance Heat sink Compounds
Primary Use:Thermal coupling of electrical/electronic devices to heat sinks
- Place of Origin:Guangdong China (Mainland)
- Model Number:CPU Heatsink-04
- L2 Cache:
- Country:China (Mainland)
- telephone:86-20-87590090
| Package: | CTN/PCS:480MEAS:55*38.5*44 |
| Place of Origin: | Guangdong China (Mainland) |
| Model Number: | CPU Heatsink-04 |
| L2 Cache: |
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