Processor Modules > Embedded-Ready Subsystems

Diamond's product line also includes following Processor Module families:
Single Board Computers
Computer-on-Modules
 

 Other Processor Module Familes

   Neptune
 EPIC Form-factor Embedded-Ready Subsystem with Integrated Autocalibrating Data Acquisition, DC/DC Power Supply, and Configurable CPU
 
 Pluto
 ETX Form-factor Embedded-Ready Subsystem with PC/104-Plus Expansion and Configurable CPU
 
 

Click below for detailed product information:

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 Processor Modules   >   Embedded-Ready Subsystems 
Embedded-Ready Subsystems
Embedded-Ready Subsystems combine the high-performance processing and leading-edge system I/O capabilities of computer-on-modules (COMs) with the modular expansion flexibility of stackable single board computers, all within a single compact, rugged, reliable, pre-integrated module. Additionally, the modules' large thermally-conductive baseplate provides both an efficient cooling solution and a standardized mounting-hole pattern that ensures interchangeability for alternate features or performance upgrades. Diamond's first series of Embedded-Ready Subsystems is based on our series of wide-temperature, rugged, ETX 3.0 compliant COMs.