Operating system, device drivers, and BIOS customization and support
Addition of latching connectors
Burn-in and screening
Conformal coating
Extended temperature testing
Full systems integration
Program management
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Specifications
Other value-added services offered to ETX COM customers include:
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Additional Development Services
> > Find out more about Diamond's custom ETX baseboard design services. < <
Application-specific ETX Baseboards
Through more than 20 years of experience producing industry-leading data acquisition I/O on PC/104 and PC/104-Plus modules and single-board computers, Diamond has developed an extensive library of
analog, digital, and I/O interface technology. This expertise is now available in the form of application-specific baseboards tuned to fit precise customer requirements, coupled with ETX COMs
implement the processing power needed to drive the application.
Part No. Description
PLT-BASE PC/104-Plus ETX baseboard
Diamond offers a standard ETX baseboard (shown above) that matches the form-factor of the ETX 3.0 COM standard. The Pluto baseboard integrates a full set of I/O headers on its top side, along with a PC/104-Plus expansion bus for modular addition of other required functions. The ETX 3.0 COM (and its heatspreader) installs on the baseboard's bottom side, as shown in the right-hand photo above.
Standard ETX Baseboard
The Pluto ETX Baseboard Matches ETX 3.0 Dimensions
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Baseboards
Part No. Description
6884011 Heatsink for ETX-N270-1600, 114 x 95 x 22mm
6884012 Heatspreader for ETX-N270-1600, 114 x 95 x 5mm
6884022 Heatsink with fan for ETX-945-xxxxx for soldered on CPUs, 114 x 95 x 30mm
6884024 Heatsink with fan for ETX-945-xxxxx for socketed CPUs, 114 x 95 x 30mm
The following heatsinks are available for Diamond's ETX COMs, giving you flexibility of thermal management for your application.
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Heatsinks
Part No. Description
MEM-1024-05 1GB DDR2 SO-DIMM SDRAM
MEM-2048-05 2GB DDR2 SO-DIMM SDRAM
Each ETX COM has a 200-pin SO-DIMM socket for system memory with support for up to 2GB of DDR2 SDRAM on some models. Each of these SO-DIMMs has an operating temperature of -40?C to +85?C. The
following memory modules are available.
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System Memory
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ETX COM Block Diagram
By virtue of their conformance to the ETX Version 3 specification, Diamond's ETX COMs provide a consistent set of on-board controllers and I/O interfaces, and are essentially interchangeable with one another. The modules include CRT and LVDS video, 10/100Mbps Ethernet, SATA, IDE, USB 2.0, audio, serial, parallel, and PS/2 ports. Additionally, they offer both 32-bit PCI and 16-bit ISA buses, allowing maximum flexibility of application development. To accommodate harsh outdoor environments, the modules also support extended operating temperatures.
Each Diamond ETX COM integrates a complete set of PC-compatible functionality, including a high-performance processor, up to 2GB of DDR2 SO-DIMM SDRAM, and an extensive set of system controllers and peripheral interfaces. CPU options range from the low-power Intel Atom to the high-performance Intel Core2Duo, enabling an optimal match to the application's performance, power, and cost requirements.
Diamond's ETX Computer-on-Module (COM) family provides a series of compact, plug-compatible, embedded computing cores for powering a wide variety of custom embedded applications. The modules are
intended to be plugged into application-specific baseboards to create a customized embedded computing subsystem--an approach that minimizes product development investments and risks, and shortens
time-to-revenue.
Description
click for a larger image
ETX COM Block Diagram
System Memory
Heatsinks
Baseboards
Additional Development Services
Specifications
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ETX Computer-on-Modules
Low power, wide-temperature, high performance ETX 3.0 Computer-on-Modules
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