High Density

Multi layers PCB
With High Density

PCB Density is being increased rapidly due to the introduction of new components such as BGA, CSP(Chip Size Package) or FC(Flip Chip). LCD related products would be also one of driven factors to accelerate density of PCBs. Furthermore, growing new market for Package Industry is requiring highly sophisticated PCB, which would be used as substitute for chip placing and interconnection.

DESIGN STANDARD & SPECIFICATION
ITEM	SPEC
No of Layers	6 Layers
Base Material	Polymide or FR-4
Material Thickness	0.4 - 2.4 mm
Conductor Width	4.7 mils
Conductor Space	4.7 mils
Finished Surface Treatment

Country:South Korea
telephone:82-031-478-3631

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