SAMPLES AVAILABLES
300mm wafers availlable, 5usd\unit min order 2500units
2500 units of
300mm silicon wafers, 12" wafers, MEMC IC CR grade
(samples availables)
Delivery Time: | 10 days after payment |
Package: | (samples availables) |
Supply Ability: | 7500 Piece/Pieces per Quarter |
Minimum Order Quantity: | 2500 Piece/Pieces |
Payment Terms: | T/T,PAYPAL |
Port: | your choice |
Fob Price: | US$12500your choice |
Brand Name: | memc |
Place of Origin: | United States |
Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...
Come From Henan More Super Hard Products Co Ltd
name: diamond backgrinding wheel application: silicon wafer Details Introduction of back grinding wheels: Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with ...
Come From Henan More Super Hard Products Co Ltd
Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...
Come From More Super Hard company