mono wafer

描述：单晶金刚石刀具经磨削可获得优良的切削刃，单晶金刚石刀具表面光洁度可达 0.01微米 以上（Ra<0.1um）世界顶级原料品牌：E6单晶金刚石。 单晶金刚石工具的应用： ...

Come From More Super Hard Products Co., Ltd

Based on the pioneering technology of intelligent high-speed parallel delta robot, Robotphoenix invented new 4-DOF parallel semiconductor wafer handling robot of single-platform and dual-platform, which broke through the bottleneck to realize a larger swing angle and higher ...

Come From Robotphoenix LLC

E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. E-Grind Wafer Back Grinding Wheel use a ...

Come From Henan E-Grind Abrasives Co., Ltd