Samples are availables
200mm wafers availlable, 1usd\unit min order 15000units
15000 units of
200mm silicon wafers, 8" wafers, MEMC IC CR grade
(samples availables)
Delivery Time: | 10 days after payment |
Package: | (samples availables) |
Supply Ability: | 55000 Piece/Pieces per Quarter |
Minimum Order Quantity: | 50 Piece/Pieces |
Payment Terms: | T/T,PAYPAL |
Port: | your choice |
Brand Name: | memc |
Place of Origin: | United States |
Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...
Come From Henan More Super Hard Products Co Ltd
name: diamond backgrinding wheel application: silicon wafer Details Introduction of back grinding wheels: Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with ...
Come From Henan More Super Hard Products Co Ltd
Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...
Come From More Super Hard company