Multicrystalline Silicon Wafers

3 x w.centennialsolar

Main: 514.461.9822

Direct: 450.424.7532

Centennial Solar

VP, Global Sales

Gordon Terlier

Have a great day

If you have any questions please do not hesitate do contact me...thank you

Surface cleanliness: Clean. Not etched.

price: $388.00 usd per kg

Qty: 624kg

condition: full pcs

Size: 100 ? 0.5 mm x 100 ? 0.5 mm

Bulk resistivity (p-type): 0.8 - 2.0 ohm.cm; p-type

Edge Defects: No Chips or Visual cracks.

Surface Conditions: No severe saw-cutting marks.

Wafer thickness: 175-225 microns

Specifications for Multicrystalline Silicon Wafers:

Wafer offer available immediately.

. Multicrystalline Silicon Wafers, Wafer offer available immediately

  • Material:Other
  • Place of Origin:United States
  • Country:Canada
  • telephone:1 450-424-7532
Delivery Time: Immedate
Package: crated
Material: Other
Place of Origin: United States
*Your name:
*Your Email:
*To:centennial Solar
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters Remaining: 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

We do inquire for you , please wait ...

Electroformed hub dicing blade for silicon wafer,copper wafer miya@moresuperhard.com

Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...

Come From Henan More Super Hard Products Co Ltd

back grinding wheels are used for the thinning and fine grinding of the silicon wafer miya@moresuperhard.com

name: diamond backgrinding wheel application: silicon wafer Details Introduction of back grinding wheels: Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with ...

Come From Henan More Super Hard Products Co Ltd

Edge chipping of silicon wafers in diamond grinding

Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...

Come From More Super Hard company