156*156mm mono silicon wafer

 

  • Country:China (Mainland)
  • telephone:86-0379-64368882
Used in manufacturing solar cell tablets. Annual production output:10,000,000 pcs.
The specification: 125mm*125mm, 156mm*156mm.
*Your name:
*Your Email:
*To:Luoyang Hongtai Semiconductor Co., Ltd.
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters Remaining: 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

We do inquire for you , please wait ...

Electroformed hub dicing blade for silicon wafer,copper wafer miya@moresuperhard.com

Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...

Come From Henan More Super Hard Products Co Ltd

back grinding wheels are used for the thinning and fine grinding of the silicon wafer miya@moresuperhard.com

name: diamond backgrinding wheel application: silicon wafer Details Introduction of back grinding wheels: Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with ...

Come From Henan More Super Hard Products Co Ltd

Edge chipping of silicon wafers in diamond grinding

Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...

Come From More Super Hard company