3 x w.centennialsolar
Main: 514.461.9822
Direct: 450.424.7532
Centennial Solar
VP, Global Sales
Gordon Terlier
Have a great day
If you have any questions please do not hesitate do contact me...thank you
Surface cleanliness: Clean. Not etched.
price: $388.00 usd per kg
Qty: 624kg
condition: full pcs
Size: 100 ? 0.5 mm x 100 ? 0.5 mm
Bulk resistivity (p-type): 0.8 - 2.0 ohm.cm; p-type
Edge Defects: No Chips or Visual cracks.
Surface Conditions: No severe saw-cutting marks.
Wafer thickness: 175-225 microns
Specifications for Multicrystalline Silicon Wafers:
Wafer offer available immediately.
Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...
Come From Henan More Super Hard Products Co Ltd
name: diamond backgrinding wheel application: silicon wafer Details Introduction of back grinding wheels: Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with ...
Come From Henan More Super Hard Products Co Ltd
Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...
Come From More Super Hard company