The diamond cutting wire saws for multicrystalline wafers

Wiresawing is the latest technology for slicing large diameter wafers used in semiconductor as well as photovoltaic industries. In order to finetune wiresawing to the modern day requirements of efficiency and productivity, it is necessary to understand the process. With this objective, an integrated model of wiresawing is being developed in our laboratory. Also experiments to validate the model and study the exact boundary conditions are being conducted.

The diamond wire saw is one of the most valuable tool capable of cutting superhard materials. The saw is produced by special process a thin layer deposit of Ni film on steel wire (matrix) followed by diamond abrasive consolidated on Ni surface. Comparing to traditional tools, diamond wire saw offers unique overail cutting abilitles such as negligible surface damage, small deflection, very thin section and slice, uniform thickness etc. It can also cut very larger sizes silicon ingots and permit more material usage, higher cutting efficiency and output with higher turnover. It is special suitable for cutting sapphire substrates for LED manufacturing.

Through breakthrough, diamond wire saw is a result of our long-term efforts of innovation and development. Our products have been successfully applied to cut sapphire, monocrystal silicon, polysilicon, magnetic materialetc.

The diamond wire diameter:0.1mm~0.3mm

With this objective, an integrated model of wiresawing is being developed in our laboratory. solar cell module wafer

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