STFs utilize NTK?fs flip chip alumina ceramic design rules for creation of high density probing platforms for VLSI and memory devices. Top surface layer can utilize Copper Polymide (CuPI) thin film system for more specialized, ultra-dense requirements. Probe card sizes can be manufactured to 100mm square or larger, depengin on your requirements. Pins or lands are optional for second level interconnection.
Features: Alumina ceramic material for TCE matching to Si wafers |
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Create a unique atmosphere in your home or office with these customizable, removable, and repositionable Magicstik Adhesive Wall Decals from Power Graphics. Enhance your decor and spaces in a hassle-free way with our wall ...
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Primary current: 5A Imax: 120A Accuracy class: 0.1% Turns ratio: 1:2500 Frequency: 50HZ-60HZ Load resistance: 20 Ohm Turns Ratio: 0.1% Withstanding volt: 4000V/1min Ambient temp: -40-+70 Degrees Celsius Storage temp: -40-+80 Degrees Celsius Encapsulate: epoxy Alternative ...
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