STFs utilize NTK?fs flip chip alumina ceramic design rules for creation of high density probing platforms for VLSI and memory devices. Top surface layer can utilize Copper Polymide (CuPI) thin film system for more specialized, ultra-dense requirements. Probe card sizes can be manufactured to 100mm square or larger, depengin on your requirements. Pins or lands are optional for second level interconnection.
Features: Alumina ceramic material for TCE matching to Si wafers |