If you are interested in that,please cotact us.
lapped wafers
type:N<111>
thickness: 285+5/-5um
resistivity:10-20
diameter: 76.2mm
Our company could supply the CZ silicon wafer.
procuct name: CZ silicon wafer lapped
diameter: 76.2mm
resistivity:10-20
thickness: 285+5/-5um
type:N<111>
Minimum Order Quantity: | 1000 Piece/Pieces |
Payment Terms: | T/T |
Place of Origin: | China (Mainland) |
Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...
Come From Henan More Super Hard Products Co Ltd
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Come From Henan More Super Hard Products Co Ltd
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Come From More Super Hard company