CZ silicon wafer
Product Details
If you are interested in that,please cotact us.
lapped wafers
type:N<111>
thickness: 285um
resistivity:1-2
diameter: 76.2mm
Our company could supply the CZ silicon wafer.
- Country:China (Mainland)
- telephone:86-0379-64368882
|
procuct name: CZ silicon wafer lapped diameter: 76.2mm resistivity:1-2 thickness: 285um type:N<111> |
Send inquiry / quota request to CZ silicon wafer
Relate products of CZ silicon wafer
Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...
Come From Henan More Super Hard Products Co Ltd
name: diamond backgrinding wheel application: silicon wafer Details Introduction of back grinding wheels: Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with ...
Come From Henan More Super Hard Products Co Ltd
Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and ...
Come From More Super Hard company
