Schottky Wafer

Based on the pioneering technology of intelligent high-speed parallel delta robot, Robotphoenix invented new 4-DOF parallel semiconductor wafer handling robot of single-platform and dual-platform, which broke through the bottleneck to realize a larger swing angle and higher ...

Come From Robotphoenix LLC

E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. E-Grind Wafer Back Grinding Wheel use a ...

Come From Henan E-Grind Abrasives Co., Ltd

SLW Series Reduce fragment rate With vacuum release port, improve efficiency Easy to install, different types of option Simple structure, and integrated design, could connect to compressed air directly, with no need extra vacuum generator Features Thin Lip Wafer Gripper ...

Come From AIRBEST(CHANGXING)TECHNOLOGY CO., LTD.