chip size (mm2/mil2) | chip thickness (?m) | bonding pad dimension (mil2) | scribe line width (?m) | top metal | back metal | passivation | wafer size (inch) | Electrical characteristics (Ta=25degC) Forward voltage (Vf)(V) |
0.28 |
SBDP70 (chip appearance)
Model Number: | SBDP70 |
Brand Name: | Genesis |
Model Number:SBD840 Brand Name:Genesis Place of Origin:Jiangsu China (Mainland) SBD840 (chip appearance) ...
Model Number:SBD540 Brand Name:Genesis SBD540 (chip appearance) ...
Model Number:SBD340 Brand Name:Genesis SBD340 (chip appearance) ...