Product Description
The Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No lead package is a chip level package using solderable metal contacts
under the package similar to DFN style packages. The DSN style package enables 100 utilization of the package area for active silicon offering a significant performance per board area advantage
compared to products in plastic molded packages. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.
Features Benefits
|
|
|
|
|
|
|
|
- Reduces Power Dissipation
|
|
|
|
|
|
|
Applications
- Buck and Boost DC-DC Converters
- Reverse Voltage and Current Protection
|