Diodes

Bourns can now provide designers with an integrated passive & active device solution that saves PCB real estate while offering remarkable electrical performance. The designers of compact electronic systems, especially handheld/wireless devices, are faced with tightening board space constraints, driving the requirement for alternative passive and active component technologies.In the last several years, there has been somewhat of a revolution in the I.C. packaging world with the birth of a generation of extremely space-efficient packaging solutions. Using Thin Film on Silicon wafer fabrication technology, Bourns offers the capability to integrate resistors, capacitors, inductors and diodes into a single monolithic device with minimal packaging overhead.Thin Film on Silicon and bipolar diode technology using DFN packaging has been put to use in "Portable Electronics" applications where the customer has specified a particular electrical response characteristic for a minimum real estate allowance. Handheld wireless devices (in particular, cell phones and PDAs) often have data and/or audio ports that connect the device to other external devices such as laptop computers and headsets.Thin Film on Silicon and bipolar diode technology with QSOP and NSOIC packages is widely used in applications that require cost reductions while also providing consistent and reliable performance. Typical applications include telecom base stations, network servers, PCs and peripheral devices.Bourns can now provide designers with an integrated passive and active solution that provides: 1. Reduction in overall package size and maximum space saving. 2. Elimination of existing package wire-bonds with their associated unwanted high frequency parasitic elements using a DFN package solution. 3. Low cost solution due to shrinking of the Bill of Materials, Pick and Place cycles reduced and decreasing overall product manufacturing costs. 4. Simple package construction while providing high reliability performance. Series 2FAA-M20R 2FAB-M20R 2FAF-M8R 2FAG-M12R 2FAI-M16R Circuit Configuration Type EMI filter with ESD Protection EMI filter with ESD Protection EMI filter with ESD Protection EMI filter with ESD Protection EMI filter with ESD Protection Resistance Range 200 ohms 100 ohms 100 ohms 100 ohms 200 ohms Resistance Tolerance

  • Country:India
  • telephone:91-22 25785099
ESD & EMI Filter Networks
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High Frequency Diode

diode at high frequency are designed for use in applications where fast switching and low noise are critical. They operate at high frequencies, typically in the GHz range, and are commonly used for RF amplification, mixing, modulation, and demodulation. High Frequency Diode ...

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General Purpose Diode

A diode general is a type of electronic component that can conduct electrical current in one direction while blocking the flow in the opposite direction. These diodes are widely used in a variety of applications, including rectification, voltage regulation, and signal mixing. ...

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NTC Diode Thermistor

NTC Diode Thermistor Specification/model format: MTG1 NTC Diode Thermistor Details NTC Diode Thermistor Material: semiconductor ceramic resistor chip /glass Applicable temperature range:-45~250℃ NTC Diode Output signal: analog signal output Use of NTC Thermistor: sensors in ...

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