chip size (mm2/mil2) | chip thickness (?m) | bonding pad dimension (mil2) | scribe line width (?m) | top metal | back metal | passivation | wafer size (inch) | Electrical characteristics (Ta=25degC) Forward voltage (Vf)(V) |
2.34 |
SBD840 (chip appearance)
Model Number: | SBD840 |
Brand Name: | Genesis |
Place of Origin: | Jiangsu China (Mainland) |
Model Number:SBD540 Brand Name:Genesis SBD540 (chip appearance) ...
Model Number:SBD340 Brand Name:Genesis SBD340 (chip appearance) ...