256/512M(X4/X8) DDR SDRAM 66TSOP Integrated Circuits

MODEL	LAYER
256/512M(X4/X8) DDR SDRAM 66TSOP	8
128/256M(X8) DDR SDRAM	8
128/256M(X16) 60fBGA Low Power(SMD)	8

Layers	8 Layers
Core thickness	32.0 MIL
Patterning	Tenting
External spec (Min.)	Conductor width	4.0 MIL
Conductor space	4.0 MIL
Thickness	64.0 MIL
Surface treatment	Hard gold

Burn-in Boards (BIBs) are used for conducting burn-in tests for screening semiconductor device quality for a variety of sensitivity attributes such as signaling, stress voltage and temperature.

Simmtechs main BIB products are Static Burn-In, Dynamic Burn-In and Intelligent Burn-In.

Country:South Korea
telephone:82-043-269-9263

256/512M(X4/X8) DDR SDRAM 66TSOP

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256/512M(X4/X8) DDR SDRAM 66TSOP Integrated Circuits

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