WLCSP (Wafer Level Chip Scale Package)
Product Details
WLCSP is a acronym of Wafer Level Chip Scale Package
Wafer-level chip scale packaging has advantages such as miniaturizing, thinning and lightening packaged chips, also realizing low manufacturing cost of packaging. The process of applying a
redistribution layer to the wafer, and solder bumps directly to the redistributed wafer.
Applied in memory, micro-processors/controllers, analog, Flash, SRAM, DRAM, ASICs and DSPs, ASICs, RF devices
- Country:Taiwan
- telephone:886-886-7-8210088
| WLCSP is a acronym of Wafer Level Chip Scale Package |
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