Hybrid Integrated Circuit

* Excellent reliability and electrical features.
High density & Reliability
* Can be applied to a variety of assembly technology such as BGA, MCM, COB, COF, COM, COS.
* High power & voltage
* High frequency range
* Easy modulation

The Characteristics of Hybrid

Sequentially print, dry, and fire conductor,
Dielectric, and resistor pastes

Processes

RuO2 doped glass

Resistors

Glass-ceramics, recrystallizing glasses

Dielectrics

Au, PdAu, PtAu
Ag, PdAg, PtAg
PtPdAg, Cu

Conductors

Al2O3, AlN, BeO

Base substrate

Materials

Process

Hybrid microelectronics is a packaging and interconnection technology for combining two or more semiconductor devices on a common interconnect substrate, typically to create a specific electrical function. The semiconductor devices may be in the form of bare unpackaged die or in miniature packages which mount on the interconnect substrate surface. The interconnection pattern may include deposited resistors, capacitors, and inductors, or these passive components may be mounted in chip form on the surface of the substrate. The assembled hybrid microcircuit may be packaged in a metal, ceramic, or plastic package coated with a protective coating or may require no additional packaging depending on the construction and the application.
In the thick film process, the individual layer is deposited by screen printing as illustrated in Fig. 1. The thick film material to be printed is referred to as an ink or paste. The ink contains three components: a functional phase which defines the electrical properties of the fired film, a binder which provides adhesion between the fired film and the substrate, and the vehicle which establishes the printing characteristics.

Fig. Typical Materials and Process used to fabricate interconnection substrate

HIC - Hybrid Integrated Circuit

Introduction