B2it Integrated Circuits

In the future, high density demand for PCB is greater than today. Therefore smaller pad and finer line/space are indispensable to PCB. By using B2it technology, we can realize high density interconnection (HDI) board.

As a new build-up technology the interconnection between layers in B2it Board is made with Ag paste bumps. The conductive bumps of Ag paste are formed by printing and curing on a Cu foil and then penetrate a dielectric material (prepreg). The interconnection between Cu foils is occurred during the lamination process under a condition of high temperature and high pressure. B2it technology has no drilling process and no Cu plating process so that we can make a shorter process time and a finer line/space.

and Camcorders

Digital camera

Note PC,

PDA, Palm,

Product	Description	Application
		Build up	PCB markers are working to develop a new generation of products that support growing demand for high-components. The build-up PCB offers high densities at a competitive cost, and also supports the market shift to chip-scale packages (CSP) and ball-grid array (BGA), leading-edge mounting technologies for semiconductor devices. For HDI (high density interconnection) application some special build-up and connectivity techniques have been established that use RCC (resin coated copper) lamination and micro via formation through laser technology. Build up Boards are applied for portable products like cellular phones and camcorders, and for fine-pitch IC packages.

Country:South Korea
telephone:82-043-269-9263

B2it

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B2it Integrated Circuits

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SIMM TECH CO., LTD

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