1. Home
  2. Electronic Components & Supplies
  3. Active Components

Flip Chip

Product Details

Assembly Packaging - GGI Flip Chip (09)GGI Flip Chip (Gold Gold interconnections):- Maximum die size: 5mm x 5mm- Maximum number of bumps: 20- Minimum bump pitch: 150 micons- Major applications in power LED, SAW, TCXO and MEMS.

Tong Hsing Electronic Industries, Ltd.

  • Country:Taiwan
  • telephone:886-886-2-2679-0122
Assembly Packaging - GGI Flip Chip

Send inquiry / quota request to Flip Chip

*Your name:
*Your Email:
*To:Tong Hsing Electronic Industries, Ltd.
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters Remaining: 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

We do inquire for you , please wait ...

Social Connect

  • mfrbee.com social network on weibo.com
  • mfrbee.com social network on twitter
  • mfrbee.com medium business blog

Browse by Category

Contact Us

  • contact mfrbee.com by email