Flip Chip
Product Details
Assembly Packaging - GGI Flip Chip (09)GGI Flip Chip (Gold Gold interconnections):- Maximum die size: 5mm x 5mm- Maximum number of bumps: 20- Minimum bump pitch: 150 micons- Major applications in power LED, SAW, TCXO and MEMS.
- Country:Taiwan
- telephone:886-886-2-2679-0122
| Assembly Packaging - GGI Flip Chip |
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