SOIC integrated Circuit
Product Details
|
Body Size
|
Lead Count
|
Stand - off
|
Body Width
|
Lead Width
|
Lead Frame Thickness
|
Lead Pitch
|
|
|
D
|
E
|
A1
|
A2
|
b
|
c
|
e
|
|
|
390
|
153
|
16
|
6
|
150
|
16
|
8
|
50
|
|
406
|
295
|
16
|
6
|
300
|
16
|
10
|
50
|
|
504
|
295
|
20
|
6
|
300
|
16
|
10
|
50
|
|
608
|
295
|
24
|
6
|
300
|
16
|
10
|
50
|
|
705
|
295
|
28
|
6
|
300
|
16
|
10
|
50
|
|
608
|
295
|
36
|
6
|
300
|
15
|
10
|
31.5
|
All Dimensions in mil. (1 mil = 25.4um)
Overall thickness is the sum of A1 and A2
Overall thickness is the sum of A1 and A2
Features
.SOIC body sizes 150 and 300 mils
.SOIC lead counts available from 16 to 28
.JEDEC standard outlines
.Wide choice of pad sizes to meet die size per customer leadframe design requirement
.Customized leadframe design capability
.Pb free process available
- Country:Malaysia
- telephone:60-4- 42448411
|
390 153 16 6 150 16 8 50 406 295 16 6 300 16 10 50 |
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