Build up Integrated Circuits
Product Details
In the future, high density demand for PCB is greater than today. Therefore smaller pad and finer line/space are indispensable to PCB. By using B2it technology, we can realize high density interconnection (HDI) board.
As a new build-up technology the interconnection between layers in B2it Board is made with Ag paste bumps. The conductive bumps of Ag paste are formed by printing and curing on a Cu foil and then penetrate a dielectric material (prepreg). The interconnection between Cu foils is occurred during the lamination process under a condition of high temperature and high pressure. B2it technology has no drilling process and no Cu plating process so that we can make a shorter process time and a finer line/space.
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