114 High Megohm Miniature Chip Resistor has
thick film gold terminals fired to one side of a ceramic
chip at about 900oC. The resistive glass does not
contain any organic materials and is applied as a continuous
film so exposure in hard vacuum environments
will not create any problems due to outgassing.
Thick film gold terminals are suited for ultrasonic ball
bonding of gold wire or TC bonding using gold or
aluminum wire.
Applications:
Hybrid Circuits
High Impedance Load
Resistors
Low Noise, High Gain
Feedback Resistors
Low Current Biological &
Medical Instrumentation
Photon Infrared Detectors
Piezoelectric
Accelerometers
Hydrophone
Preamplifiers
Extremely Low Noise
Cryogenically Cooled
First Stage Detection
Circuits
Electret Microphones
Telecommunications
Line Station Monitoring
Tolerance: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1X106 to 9X109
Model 114 High Megohm Miniature Chip Resistor has thick |
Model 102 incorporates an ELTEC Model 112 chip resistor element with nickel ribbon leads soldered to the terminals. These leads permit connection by soldering or spotwelding. The Model 102 permits the use of ELTEC miniature chip resistors by those who do not have the bonding ...
Come From Silverlight Ltd.
Model 112 High Megohm Miniature Chip Resistor has thick film platinum/gold terminals fired to one side of a ceramic chip at about 900oC. The resistive glass does not contain any organic materials and is applied as a continuous film so exposure in hard vacuum environments will ...
Come From Silverlight Ltd.