4 layers blind&buried PCB
Product Details
Test: AOI Test,Flying-needle Test,Fixture Test
Surface Treatment: Hot Air Leveling,Gold/Nickel Plating,Immersion Gold/Tin/Sliver,Gold Finger, Peeable mask,Carbon Ink,OSP(Entek,F2)
Press: Thickness Tolerance 8% Wrap/Twist 0.5% Inner Opening (min) (1) 4/L:5mil(0.125mm)(2) 6/L-8/L:6mil(0.15mm)(3) 8/L or above:8mil(0.2mm)
Selective Gold Plating: Gold Thickness 100u (2.5um)
Solder Mask: Bridge 3.0mil(0.075mm) Position Accurary 1.5mil(0.0375mm)
Plating Hole: Minimum Hole Size 6mil (0.15mm) Aspect Ratio (max) 12:1 Position Accurary +/-1.8mil(0.045mm)
Drilling (Minimum size): Mechanical drilling 8mil(0.2mm) Laser drilling 4mil(0.1mm)
Minimum Thickness of CCL: 0.5mil (0.0875mm) (Include Cu)
Board Thickness: Min0.15mm,Max7.0mm
Base Copper Thickness: 1/3oz-6oz
Layer(mass production): 2 to 24 Layers rigid PCB
Copper Clad Laminate: FR4,FR4(Halogen free),FR5,CEM-1 ,CEM-3
Supply Ability:
(1)Number of layer: 4 layers
(2)Blind & Buried Hold
(3)Laser Drilling/Ablation
(4)BGA
- Min. Line Spacing:3 mil
- Min. Line Width:3 mil
- Min. Hole Size:0.1 mm
- Board Thickness:1.0 mm
- Copper Thickness:1 oz
- Base Material:FR4
- Brand Name:SY
- Place of Origin:Guangdong China (Mainland)
- Country:China (Mainland)
- telephone:86-755-27933305,29110913,29110915
| Supply Ability: | 25000 Square Meter per Month |
| Minimum Order Quantity: | 1 Piece/Pieces |
| Payment Terms: | L/C,T/T |
| Min. Line Spacing: | 3 mil |
| Min. Line Width: | 3 mil |
| Min. Hole Size: | 0.1 mm |
| Board Thickness: | 1.0 mm |
| Copper Thickness: | 1 oz |
| Base Material: | FR4 |
| Brand Name: | SY |
| Place of Origin: | Guangdong China (Mainland) |
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