Rigid PCB

  • Rigid PCB Process Capability
  • PANELS
    TRACE & SPACE
    • Max. Panel Size: 21" x 23" (Manual), 20" x 24" (Automatic)
    • Min. Panel Border: 0.5"
    • Trace/Space (External, 1 oz.) 4/4 mil
    • Trace/Space (Internal, 1 oz.) 4/4 mil
    • External 2 oz. 5/5 mil
    • External 3 oz. 8/8 mil
    • Internal 2 oz. 4/5 mil
    MECHANICAL DRILLING VIAS
    • Min. Finished Hole Size 8 mil
    • Min. Drill Size 10 mil
    • Aspect Ratio 8:1
    • Tapered Hole
    • Buried Vias
    • Blind Vias
    • Controlled Depth Drill
    • Micro Via Min. 4mil
    • Laser Type CO2
    • Micro Via Capture Pad/Ablated Hole
    • Micro Via Materials & Dielectric (Die.) RCC/PP
    • Controlled Impedance Rambus/Single Ended Differential
    BOARD PROPERTIES FINISHES
    • Max. Layer Count 20
    • Min. Core Thickness 2 mil
    • Min. Thickness 0.010"
    • Max. Thickness 0.250"
    • Selective Soft Gold (MCM Au: Max. 40u")
    • Selective Hard Gold (SIMM Au: Max. 50u")
    • Immersion Gold (1~10u")
    • HASL
    • OSP (Entek CU106A, CU106AX)
    • Immersion Tin
    • Immersion Silver
    • Carbon Ink
    • Other Peelable Ink
    MATERIALS PRIMARY MATERIAL SUPPLIERS FOR LAMINATE & REPREG
    • Multifunctional FR-4
    • Bismalemide Triazine (BT)
    • Polyimide
    • CAF Resistance FR4
    • Flex
    • Getek
    • Rogers 4350
    • Rogers 4003
    • Isola FR408
    • TG 150C FR4
    • ITEQ IT150TC
    • Halogen Free
    • Nan Ya
    • Isola
    • PolyClad
    • Elite
    • ITEQ
    • TUC
    TESTING CAPABILITY SOLDERMASK
    • Flying Probe
    • Universal & Dedicate
    • AOI
    • LPI Solder Mask
    • Solder Dam Min. 3 mil
    • LPI Solder Mask Halogen Free
    • Green, Red, Blue, Yellow Colors Available
    PROCESS CAPABILITIES QUALITY ASSURANCE
    • Plated over Via in Pad
    • Panel Plate
    • Pattern Plate
    • FR4 with Getek
    • Through Hole Max. Aspect Ratio 8:1
    • Blind Hole Max. Aspect Ratio 0.7:1
    • Min. Copper Thickness in Hole 0.7mil
    • Sequential Lamination
    • Rigid-Flex/Flex Circuits
    • ISO 9001
    • QS 9000
    HEAVY COPPER CAPABILITY DATA FORMATS
    • Copper Weight (Inner layer) 2 ~ 6 oz.
    • GERBER
    • ODB++
    • GENESIS
    BACKPLANE CAPABILITY  
    • Max. Board Size 20" x 24", 21" x 23"
    • Impedance Control Tolerance +/- 5 ~ 8%
     
  • Country:Taiwan
  • telephone:886-3-3667652
Rigid PCB
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Electronic contract assembly for consumer electronics board assemble pcb pcba customize factory

Shenzhen STHL PCBA was established in 2006 (named STYL from 2006 to 2015, renamed STHL in 2015) and is a high-quality electronic manufacturing service provider. We provide global customers with electronic material procurement, PCB production, PCBA assembly, cable assembly, ...

Come From Shenzhen STHL Electronics Co.,Ltd

Electronic contract assembly for consumer electronics pcb pcba customize factory

Shenzhen STHL PCBA was established in 2006 (named STYL from 2006 to 2015, renamed STHL in 2015) and is a high-quality electronic manufacturing service provider. We provide global customers with electronic material procurement, PCB production, PCBA assembly, cable assembly, ...

Come From Shenzhen STHL Electronics Co.,Ltd

Electronic contract assembly for consumer electronics pcb pcba customize factory

Shenzhen STHL PCBA was established in 2006 (named STYL from 2006 to 2015, renamed STHL in 2015) and is a high-quality electronic manufacturing service provider. We provide global customers with electronic material procurement, PCB production, PCBA assembly, cable assembly, ...

Come From Shenzhen STHL Electronics Co.,Ltd