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PANELS
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TRACE & SPACE
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- Max. Panel Size: 21" x 23" (Manual), 20" x 24" (Automatic)
- Min. Panel Border: 0.5"
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- Trace/Space (External, 1 oz.) 4/4 mil
- Trace/Space (Internal, 1 oz.) 4/4 mil
- External 2 oz. 5/5 mil
- External 3 oz. 8/8 mil
- Internal 2 oz. 4/5 mil
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MECHANICAL DRILLING
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VIAS
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- Min. Finished Hole Size 8 mil
- Min. Drill Size 10 mil
- Aspect Ratio 8:1
- Tapered Hole
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- Buried Vias
- Blind Vias
- Controlled Depth Drill
- Micro Via Min. 4mil
- Laser Type CO2
- Micro Via Capture Pad/Ablated Hole
- Micro Via Materials & Dielectric (Die.) RCC/PP
- Controlled Impedance Rambus/Single Ended Differential
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BOARD PROPERTIES
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FINISHES
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- Max. Layer Count 20
- Min. Core Thickness 2 mil
- Min. Thickness 0.010"
- Max. Thickness 0.250"
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- Selective Soft Gold (MCM Au: Max. 40u")
- Selective Hard Gold (SIMM Au: Max. 50u")
- Immersion Gold (1~10u")
- HASL
- OSP (Entek CU106A, CU106AX)
- Immersion Tin
- Immersion Silver
- Carbon Ink
- Other Peelable Ink
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MATERIALS
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PRIMARY MATERIAL SUPPLIERS FOR LAMINATE & REPREG
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- Multifunctional FR-4
- Bismalemide Triazine (BT)
- Polyimide
- CAF Resistance FR4
- Flex
- Getek
- Rogers 4350
- Rogers 4003
- Isola FR408
- TG 150C FR4
- ITEQ IT150TC
- Halogen Free
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- Nan Ya
- Isola
- PolyClad
- Elite
- ITEQ
- TUC
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TESTING CAPABILITY
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SOLDERMASK
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- Flying Probe
- Universal & Dedicate
- AOI
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- LPI Solder Mask
- Solder Dam Min. 3 mil
- LPI Solder Mask Halogen Free
- Green, Red, Blue, Yellow Colors Available
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PROCESS CAPABILITIES
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QUALITY ASSURANCE
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- Plated over Via in Pad
- Panel Plate
- Pattern Plate
- FR4 with Getek
- Through Hole Max. Aspect Ratio 8:1
- Blind Hole Max. Aspect Ratio 0.7:1
- Min. Copper Thickness in Hole 0.7mil
- Sequential Lamination
- Rigid-Flex/Flex Circuits
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HEAVY COPPER CAPABILITY
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DATA FORMATS
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- Copper Weight (Inner layer) 2 ~ 6 oz.
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BACKPLANE CAPABILITY
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- Max. Board Size 20" x 24", 21" x 23"
- Impedance Control Tolerance +/- 5 ~ 8%
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