Rigid Printed Circuit Boards

Rigid-Flex Technologies - integrates Flexible Circuit - into Rigid Board Technology

Analytical Services - including surface analysis, failure analysis, chemical analysis, thermal analysis, mechanical testing, thermal cycling, and environmental testing.

Signal Integrity Validation - Large variety of base materials to cover the needs for high speed/low loss. In addition advanced high frequency measurement techniques are used to verify compliance to specifications.

Micro Via - Over 100 sets laser drilling systems (CO2 and UV/Yag), Skipped, telescopic, stacked, 16+ layers, 0.2 mm via, 2.0 mil ZBC, RoHS compliance, Lead free & Halogen free

Multilayer Technologies - Layers (2-40), Lines and Spaces (Volume 3/3 Prototype 2/2), Controlled Impedance (+/- 10% Standard), Blind and Buried Vias, Buried Capacitance, Microvias, High Performance and Emerging Materials, Sequential Lamination, Ultra Fine Pitch