Multi-layer Thick-Film circuit

Multi-layer Thick-Film circuit (Using high precious metals like platinum, palladium, Ruthenium, Gold and Silver) Gold & Aluminum wire bonding hybrid packages Chip-on-Board (COB) Chip Scale Packages (CSP) Printed Circuit Board Assembly - SMT and Through Hole (PCBA) Custom hybrid packages for CCTV camera and Infra Red sensors Flex circuit assembly SIP, DIP and custom pins packages We serve the global market, catering to the specific needs of a broad range of industries such as automotive electronics, consumer electronics, instruments, microwave modules, sensors, power supplies and telecommunication electronics. Our facilities include a 10K-class cleanroom, more than 1,500sq m of manufacturing facility and more than 1,800 sq m of total factory area. To back our commitment to our customers, we have established the engineering expertise, materials management, production facilities and quality system to meet customers unique requirements.