Outline |
A highly thermally conductive insulated metal substrate (IMS) consisting of an aluminum base, an epoxy-based insulation layer with a high inorganic content filler demonstrating high thermal conductivity, and a conductive foil, thereby realizing thermal resistance equivalent to, or less than that of an alumina ceramic substrate. |
Features |
(1) High thermal conductivity (a lineup with maximum conductivity of 8 W/mK) (2) High reliability (voltage resistance, heat resistance, heat shock resistance, durability) (3) Wire bonding enabled (ACA grade) |
Use |
(1) Industrial electronic equipment (transistor and diode modules, step and servo motors, SSR, etc.) (2) Automotive electrical component (power driven power-steering controller, inverter for (H)EV, etc. (3) Power supply (AC-DC converter for telecommunications, OA, semiconductor equipment) (4) Home appliances (hi-fi amplifiers, inverters for air conditioners, etc.) (5) Others (PDP, LED, and many others) |
DENKA HITTPLATE Insulated thermally conductive metal circuit board |