Copper Clad Laminates
Product Details
Paper-base and epoxy glass-base copper clad laminates available in various grades like fr4, xpc, fr1,22f, fr2, cem-1, cem-3 specially used for printed circuit boards.
Paper-base and epoxy glass-base copper clad laminates available in various grades like fr4, xpc, fr1
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- Model Number:MI-CCL
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Relate products of Copper Clad Laminates
Perforated metal Materials for Metal Cladding Panels: Stainless steel, brass plate, copper, aluminum, nickel and nonmetal plate. Hole shape: Round, square, hexagonal, triangle hole, scale, diamond, etc Surface treatment: Powder coated, galvanized, oxidation, PVDF Plate ...
Flexible copper foil laminated connector consists of C 11000 copper foils,the both ends of which are press-welded together.The welding process is also called molecular diffusion welding which makes the lamination pressed and heated with each other,and then contact ares is ...
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