main board PCB for mobile

Lead Time: sample mass production : 1.S/D L:3days;4-8L:5-15days;   2.S/D L:5days;4-8L:10-25days

Test: AOI Test,Flying-needle Test,Fixture Test

Surface Treatment: Hot Air Leveling,Gold/Nickel Plating,Immersion Gold/Tin/Sliver,Gold Finger, Peeable mask,Carbon Ink,OSP(Entek,F2)

Press: Thickness Tolerance 8% Wrap/Twist 0.5% Inner Opening (min) (1) 4/L:5mil(0.125mm)(2) 6/L-8/L:6mil(0.15mm)(3) 8/L or above:8mil(0.2mm)

Selective Gold Plating: Gold Thickness 100u (2.5um)

Solder Mask: Bridge 3.0mil(0.075mm) Position Accurary 1.5mil(0.0375mm)

Plating Hole: Minimum Hole Size 6mil (0.15mm)  Aspect Ratio (max) 12:1 Position Accurary +/-1.8mil(0.045mm)

Drilling (Minimum size): Mechanical drilling 8mil(0.2mm) Laser drilling 4mil(0.1mm)

Minimum Thickness of CCL: 0.5mil (0.0875mm) (Include Cu)

Board Thickness: Min0.15mm,Max7.0mm

Base Copper Thickness: 1/3oz-6oz

Copper Clad Laminate: FR4,FR4(Halogen free),FR5,CEM-1 ,CEM-3

Layer(mass production): 2 to 24 Layers PCB

 Supply Ability:

We can gurantee the quality of our products,and deliver on schedule. Low price and high quality of kinds of PCB and PCBA.

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