Lead Time: sample mass production : 1.S/D L:3days;4-8L:5-15days; 2.S/D L:5days;4-8L:10-25days
Test: AOI Test,Flying-needle Test,Fixture Test
Surface Treatment: Hot Air Leveling,Gold/Nickel Plating,Immersion Gold/Tin/Sliver,Gold Finger, Peeable mask,Carbon Ink,OSP(Entek,F2)
Press: Thickness Tolerance 8% Wrap/Twist 0.5% Inner Opening (min) (1) 4/L:5mil(0.125mm)(2) 6/L-8/L:6mil(0.15mm)(3) 8/L or above:8mil(0.2mm)
Selective Gold Plating: Gold Thickness 100u (2.5um)
Solder Mask: Bridge 3.0mil(0.075mm) Position Accurary 1.5mil(0.0375mm)
Plating Hole: Minimum Hole Size 6mil (0.15mm) Aspect Ratio (max) 12:1 Position Accurary +/-1.8mil(0.045mm)
Drilling (Minimum size): Mechanical drilling 8mil(0.2mm) Laser drilling 4mil(0.1mm)
Minimum Thickness of CCL: 0.5mil (0.0875mm) (Include Cu)
Board Thickness: Min0.15mm,Max7.0mm
Base Copper Thickness: 1/3oz-6oz
Copper Clad Laminate: FR4,FR4(Halogen free),FR5,CEM-1 ,CEM-3
Layer(mass production): multi-layer(2 to 24) Layers PCB
Supply Ability:
We can gurantee the quality of our products,and deliver on schedule. Low price and high quality of kinds of PCB and PCBA.
Supply Ability: | 25000 Square Meter per Month |
Minimum Order Quantity: | 1 Piece/Pieces |
Payment Terms: | L/C,T/T |
Min. Line Spacing: | 0.1 mm |
Min. Line Width: | 0.15 mm |
Min. Hole Size: | 0.15 mm |
Board Thickness: | 1.6 mm |
Copper Thickness: | 2.0 OZ |
Base Material: | FR4 |
Brand Name: | SY |
Place of Origin: | Guangdong China (Mainland) |
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination ...
Come From Xinfeng Huihe Circuits Co., Ltd.