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Passive Components
Circuit Boards
Product Details
Layer: 4 Air Gaps
Material: 3L PI
Board Thickness: 0.4 mm
Surface Finish: Immersion Gold
Copper Thickness: H oz RA Cu
Remark:Mobile Phone
ExPlus Co., Ltd. (Taiwan)
Country:
Taiwan
telephone:
886-3-3116170
Copper Thickness: H oz RA Cu
Remark:Mobile Phone
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